Electronic Design July 2013 Issue

Electronic Design Magazine July 2013 editionHere is new edition of Electronic Design magazine July 2013. In this issue, you can read latest technical information needed by electronic engineers and engineering managers. Here are feature articles for this month.

FEATURES

Top 101 Components of 2013
Survey Says Design Engineers Have Power On Their Minds: Supercap, DC/DC Converters and Charging Coil Garner Four Of The Top 10 Spots On Annual List

Bluetooth And Wi-Fi Rule The Airwaves
These two core wireless technologies continue to dominate short-range applications with new features and benefits.

Advanced Packaging Delivers Capacity And Performance
High-density BGAs and 3D stacking increase compute and storage density.

Matterform Interview – Low Cost 3D Scanner
The Matterform 3D Scanner allows anyone to take a physical object, and turn it into a digital 3D model on your computer.

Transaction-based Verification And Emulation Combine For Multi-megahertz Verification Performance
Transaction-based verification is becoming the emulation mode of choice because of its unique ability to keep pace with the growing verification support requirements of the latest high-performance, industry-standard interfaces.

Free Subscription to Electronic Design Magazine July 2013

Geographic Eligibility: USA, Canada, Mexico. If you are in Europe, please click here: Electronic Design Europe

About Electronic Design Magazine:
Electronic Design serves the technical information needs of electronic engineers and engineering managers responsible for the design and development of EOEM products and systems. Readers are kept abreast of the rapid advances in technology and their applications at the chip, board and systems levels.

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